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IEC 60749-8 Ed. 1.0 b:2002, Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing
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IEC 60773 Ed. 1.0 b:1983, Test methods and apparatus for measurement of the operational characteristics of brushes
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IEC 60772 Ed. 1.0 b:1983, Electrical penetration assemblies in containment structures for nuclear power generating stations
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IEC 60770-2 Ed. 2.0 en:2003, Transmitters for use in industrial-process control systems - Part 2: Methods for inspection and routine testing
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IEC 60768 Ed. 1.0 b:1983, Process stream radiation monitoring equipment in light water nuclear reactors for normal operating and incident conditions
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IEC 60767 Ed. 1.0 b:1983, Helical-scan video-tape cassette system using 12.65 mm (0.5 in) magnetic tape on type beta-format
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IEC 60763-3-1 Ed. 1.0 b:1992, Specification for laminated pressboard: Part 3: Specifications for individual materials - Sheet 1: Specifications for ... board, Types LB 3.1.1, 3.1.2, 3.3.1 and 3.3.2
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IEC 60763-1 Ed. 1.0 b:1983, Specification for laminated pressboard. Part 1: Definitions, classification and general requirements
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IEC 60760 Ed. 2.0 b:1989, Flat, quick-connect terminations
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IEC 60759 Ed. 1.0 b:1983, Standard test procedures for semiconductor X-ray energy spectrometers
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IEC 60757 Ed. 1.0 b:1983, Code for designation of colours
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IEC 60756 Ed. 2.0 b:1991, Non-broadcast video tape recorders - Time base stability
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IEC/TR 60755 Ed. 1.0 b:1983, General requirements for residual current operated protective devices
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IEC 60754-1 Ed. 2.0 b:1994, Test on gases evolved during combustion of materials from cables - Part 1: Determination of the amount of halogen acid gas
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IEC 60749-9 Ed. 1.0 b:2002, Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking
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IEC 60749-17 Ed. 1.0 b:2003, Semiconductor devices - Mechanical and climatic test methods - Part 17: Neutron irradiation
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IEC 60749-7 Ed. 1.0 b:2002, Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases
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IEC 60749-6 Ed. 1.0 b:2002, Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature
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IEC 60749-4 Ed. 1.0 b:2002, Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test
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IEC 60749-3 Ed. 1.0 b:2002, Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual inspection
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IEC 60749-34 Ed. 1.0 b:2005, Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
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IEC 60749-32 Ed. 1.0 b:2002, Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices
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IEC 60749-31 Ed. 1.0 b:2002, Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic-encapsulated devices
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IEC 60749-30 Ed. 1.0 b:2005, Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
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IEC 60749-29 Ed. 1.0 b:2003, Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test
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IEC 60749-24 Ed. 1.0 b:2005, Semiconductor devices - Mechanical and climatic test methods - Part 24: Accelerated moisture resistance - Unbiased HAST
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IEC 60749-22 Ed. 1.0 b:2002, Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength
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IEC 60749-21 Ed. 1.0 b:2005, Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
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IEC 60749-20 Ed. 1.0 b:2002, Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat
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IEC 60749-1 Ed. 1.0 b:2002, Semiconductor devices - Mechanical and climatic test methods - Part 1: General
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