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Application of Fracture Mechanics in Electronic Packaging: Presented at the 1997 Asme International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas (Amd Series) Application of Fracture Mechanics in Electronic Packaging: Presented at the 1997 Asme International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas by American Society of Mechanical Engineers
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