Testing of Interposer-Based 2.5D Integrated Circuits > Editions
by Ran Wang
Published March 20th 2017
by Springer
Kindle Edition, 318 pages
Published March 20th 2017
by Springer
1st ed. 2017, Kindle Edition, 318 pages
Published March 23rd 2017
by Springer
Paperback, 198 pages
Published May 9th 2018
by Springer
Softcover reprint of the original 1st ed. 2017, Paperback, 196 pages
Published March 29th 2017
by Springer
1st ed. 2017, Hardcover, 196 pages