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Microelectronics Packaging Handbook > Editions

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by Rao R. Tummala First published January 31st 1997

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Microelectronics Packaging Handbook: Subsystem Packaging Part III
Microelectronics Packaging Handbook: Subsystem Packaging Part III (Hardcover)
Published January 31st 1997 by Springer
2nd, Hardcover, 628 pages
Author(s):
ISBN:
9780412084515 (ISBN10: 0412084511)
ASIN:
0412084511
Edition language:
English
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