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Microelectronics Packaging Handbook, 3-part set > Editions

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by Rao R. Tummala First published January 1st 1997

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Microelectronics Packaging Handbook, 3-part set: Part I: Technology Drivers Part II: Semiconductor Packaging Part III: Subsystem Packaging
Microelectronics Packaging Handbook, 3-part set: Part I: Technology Drivers Part II: Semiconductor Packaging Part III: Subsystem Packaging (Hardcover)
Published January 31st 1997 by Springer
2nd, 2nd ed. 1997, Hardcover, 3,000 pages
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ISBN:
9780412084614 (ISBN10: 0412084619)
ASIN:
0412084619
Edition language:
English
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MICROELECTRONICS PACKAGING HANDBOOK, 3-PART SET: PART I: TECHNOLOGY DRIVERS PART II: SEMICONDUCTOR PACKAGING PART III: SUBSYSTEM PACKAGING: TECHNOLOGY DRIVERS PT. 1
MICROELECTRONICS PACKAGING HANDBOOK, 3-PART SET: PART I: TECHNOLOGY DRIVERS PART II: SEMICONDUCTOR PACKAGING PART III: SUBSYSTEM PACKAGING: TECHNOLOGY DRIVERS PT. 1 (Hardcover)
Published January 1st 1997 by SPRINGER
Hardcover, 0 pages
Author(s):
ASIN:
B00E41UAXI
Edition language:
English
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