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Wafer Level 3-D ICs Process Technology > Editions

by Chuan Seng Tan First published August 6th 2008

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Wafer Level 3-D ICs Process Technology (Integrated Circuits and Systems)
Wafer Level 3-D ICs Process Technology (Integrated Circuits and Systems)
Published June 29th 2009 by Springer
Kindle Edition, 660 pages
Author(s):
ISBN:
9780387765341 (ISBN10: 0387765344)
ASIN:
B0DF2JGKM9
Edition language:
English
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Wafer Level 3-D ICs Process Technology (Integrated Circuits and Systems)
Wafer Level 3-D ICs Process Technology (Integrated Circuits and Systems)
Published June 29th 2009 by Springer
2009, Kindle Edition, 660 pages
Author(s):
ASIN:
B00A9YG6QO
Edition language:
English
Average rating:
0.0 (0 ratings)
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Wafer Level 3-D ICs Process Technology (Integrated Circuits and Systems)
Wafer Level 3-D ICs Process Technology (Integrated Circuits and Systems)
Published December 8th 2010 by Springer
2008, Paperback, 422 pages
Author(s):
ISBN:
9781441945624 (ISBN10: 1441945628)
ASIN:
1441945628
Edition language:
English
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Wafer Level 3-D ICs Process Technology (Integrated Circuits and Systems)
Wafer Level 3-D ICs Process Technology (Integrated Circuits and Systems)
Published September 19th 2008 by Springer
2009, Hardcover, 422 pages
Author(s):
ISBN:
9780387765327 (ISBN10: 0387765328)
ASIN:
0387765328
Edition language:
English
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