Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs > Editions

Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs (Hardcover)

Published December 2nd 2013 by Springer

2014, Hardcover, 263 pages

less detail

Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs (Kindle Edition)

Published November 19th 2013 by Springer

Kindle Edition, 439 pages

less detail

Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs 2014 edition by Noia, Brandon, Chakrabarty, Krishnendu (2013) Hardcover

Published by Springer

2014, Hardcover, 0 pages

less detail

Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs by Brandon Noia (2013-11-16)

Published January 1st 1602 by Springer

Hardcover, 0 pages

less detail

Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs (Paperback)

Published August 23rd 2016 by Springer

Softcover reprint of the original 1st ed. 2014, Paperback, 263 pages

less detail

Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs (Paperback)

Published November 27th 2013 by Springer

Paperback, 264 pages

less detail