Chip War: The Fight for the World's Most Critical Technology

by Chris Miller

Jim Keller, the star semiconductor designer who’s widely credited for transformative work on chips at Apple, Tesla, AMD, and Intel, has said he sees a clear path toward a fifty times increase in the density with which transistors can be packed on chips. First, he argues, existing fin-shaped transistors can be printed thinner to allow three times as many to be packed together. Next, fin-shaped transistors will be replaced by new tube-shaped transistors, often called “gate-all-around.” These are wire-shaped tubes that let an electric field be applied from all directions—top, sides, and bottom—providing better control of the “switch” to cope with challenges as transistors shrink. These tiny wires will double the density at which transistors can be packed, Keller argues. Stacking these wires on top of each other can increase density eight times further, he predicts. This adds up to a roughly fifty times increase in the number of transistors that can fit on a chip. “We’re not running out of atoms,” Keller has