Noyce used Hoerni’s planar process to build multiple transistors on the same chip. Because the planar process covered the transistor with an insulating layer of silicon dioxide, Noyce could put “wires” directly on the chip by depositing lines of metal on top of it, conducting electricity between the chip’s transistors. Like Kilby, Noyce had produced an integrated circuit: multiple electric components on a single piece of semiconductor material. However, Noyce’s
