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IEC 60191-2W Ed. 1.0 b:1999, Twenty-first supplement
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IEC 60216-1 Ed. 5.0 b:2001, Electrical insulating materials - Properties of thermal endurance - Part 1: Ageing procedures and evaluation of test results
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IEC 60215 Ed. 3.0 b:1987, Safety requirements for radio transmitting equipment
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IEC 60204-32 Ed. 1.0 b:1998, Safety of machinery - Electrical equipment of machines - Part 32: Requirements for hoisting machines
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IEC 60204-1 Ed. 5.0 b:2005, Safety of machinery - Electrical equipment of machines - Part 1: General requirements
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IEC 60194 Ed. 5.0 en:2006, Printed board design, manufacture and assembly - Terms and definitions
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IEC 60191-6 Ed. 2.0 en:2004, Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
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IEC 60191-6-2 Ed. 1.0 en:2001, Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings ... for 1,50 mm, 1,27 mm and 1,00 mm pitch bal
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IEC 60191-6-12 Ed. 1.0 en:2002, Mechanical standardization of semiconductor devices: Part 6-12: General rules for the preparation of outline drawings ... guide for fine-pitch land grid array
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IEC 60191-5 Ed. 2.0 b:1997, Mechanical standardization of semiconductor devices - Part 5: Recommendations applying to integrated circuit packages using tape automated bonding
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IEC 60191-4 Ed. 2.2 b:2002, Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
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IEC 60191-3 Ed. 2.0 b:1999, Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits
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IEC 60191-2Z Ed. 1.0 en:2000, Twenty-fourth supplement to Publication 60191-2 (1966) MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - Part 2: Dimensions
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IEC 60191-2Y Ed. 1.0 en:2000, Vingt-troisiFme complTment a la Publication 60191-2 (1966)
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IEC 60191-2X Ed. 1.0 b:1999, Mechanical standardization of semiconductor devices - Part 2: Dimensions
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IEC 60118-7 Ed. 2.0 b:2005, Electroacoustics - Hearing aids - Part 7: Measurement of the performance characteristics of hearing aids for production, supply and delivery quality assurance purposes
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IEC 60191-2T Ed. 1.0 b:1996, Eighteenth supplement
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IEC 60191-2 Ed. 1.0 b:1966, Mechanical standardization of semiconductor devices. Part 2: Dimensions
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IEC 60188 Ed. 3.0 b:2001, High-pressure mercury vapour lamps - Performance specifications
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IEC 60173 Ed. 1.0 b:1964, Colours of the cores of flexible cables and cords
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IEC 60169-22 Ed. 1.0 b:1985, Radio-frequency connectors. Part 22: R.F. two-pole bayonet coupled connectors for use with shielded balanced cables having twin inner conductors (Type BNO)
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IEC 60168 Ed. 4.2 b:2001, Tests on indoor and outdoor post insulators of ceramic material or glass for systems with nominal voltages greater than 1000 V
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IEC 60167 Ed. 1.0 b:1964, Methods of test for the determination of the insulation resistance of solid insulating materials
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IEC 60146-2 Ed. 2.0 b:1999, Second Edition: Semiconductor converters - Part 2: Self-commutated semiconductor converters including direct d.c. converters
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IEC 60143-3 Ed. 1.0 b:1998, Series capacitors for power systems - Part 3: Internal fuses
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IEC 60143-1 Ed. 4.0 b:2004, Series capacitors for power systems - Part 1: General
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IEC 60139 Ed. 2.0 en:2000, Preparation of outline drawings for cathode-ray tubes, their components, connections and gauges
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IEC 60133 Ed. 4.0 b:2000, Dimensions of pot-cores made of magnetic oxides and associated parts
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IEC 60127-10 Ed. 1.0 b:2001, Miniature fuses - Part 10: User guide for miniature fuses
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IEC 60122-3 Ed. 3.0 b:2001, Quartz crystal units of assessed quality - Part 3: Standard outlines and lead connections
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