Application of Fracture Mechanics in Electronic Packaging: Presented at the 1997 Asme International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas

by American Society of Mechanical Engineers

Twenty-three technical papers from the November 1997 symposium show how applications of the mechanics of fracture help to maintain the reliability of modern electronic components even while they become faster, smaller, and cheaper.

193 pages, Hardcover

First published November 15, 1997