Electrothermal Analysis of VLSI Systems

by Yi-Kan Cheng

This text addresses electrothermal problems in modern VLSI systems. Part I, The Building Blocks, discusses electrothermal phenomena and the fundamental building blocks that electrothermal simulation requires (including power analysis, temperature-dependent device modeling, thermal/electrothermal simulation, and experimental setup-calibration). Part II, The Applications, discusses three important applications of VLSI electrothermal analysis including temperature-dependent electromigration diagnosis, cell-level thermal placement and temperature-driven power and timing analysis. This work should be useful for researchers in the fields of IC reliability analysis and physical design, as well as VLSI designers and graduate students.

240 pages, Paperback

First published January 1, 2000