Microelectronics Technology: Polymers for Advanced Imaging and Packaging

by Elsa Reichmanis (Editor), Christopher K. Ober (Editor), Scott A. MacDonald (Editor)

Provides an up-to-date assessment of chemically amplified resist materials chemistry and process considerations. Reports novel chemistry for single layer 193nm lithographic applications. Discusses new approaches to silicon-containing resists and multilevel processes. Explores the design of
low-dielectric polymer materials for microelectronic applications.

590 pages, Hardcover

First published May 5, 1995