Micromachining and Micropackaging of Transducers

by C.D. Fung

Covering the technology of the formation and packaging of microstructures for transducer applications, the papers in this book address isotropical and anisotropical etching of silicon and other materials by electrochemical, chemical and other techniques; and describe the adaptation of advanced integrated circuit technology and laser drilling to novel microstructures. Packaging considerations and materials (including various encapsulants, adhesives and specialty polymers) are emphasized to provide potentially high reliability transducer assemblies. The many application examples given include sensor structures and systems for chemical sensing, flow measurement, pressure measurement, enzyme reaction and other biomedical and industrial applications. Engineers and researchers in the industrial and academic community will value this book, as it describes the state of the art of machining and microsensor packaging, identifies existing techniques, will be useful when applying these techniques to other microstructures and devices.

252 pages, Hardcover

First published January 1, 1985