Manufacturing Challenges in Electronic Packaging

by Yuan C. Lee (Editor), W.T. Chen

This book provides a single source reference that addresses both advanced packaging and manufacturing activities, enhanced by reviews and in-depth analysis. The common theme throughout the book is how to manufacture with only one defective package in a million escaping undetected. The book will become the most important reference for professionals who need to meet this goal through their design and manufacturing activities.

272 pages, Hardcover

First published December 31, 1997