Resilient Hybrid Electronics for Extreme/Harsh Environments

by Amanda Schrand (Editor), Larry (L.J.) Richard Holmes (Editor), Eric MacDonald (Editor)

The success of future innovative technology relies upon a community with a shared vision. Here, we present an overview of the latest technological progress in the field of printed electronics for use in harsh or extreme environments. Each Chapter unlocks scientific and engineering discoveries that will undoubtedly lead to progression from proof of concept to device creation. The main topics covered in this book include some of the most promising materials, methods and the ability to integrate printed materials with commercial components to provide the basis for the next generation of electronics that are dubbed ‘survivable’ in environments with high g-forces, corrosion, vibration and large temperature fluctuations. A wide variety of materials are discussed that contribute to robust hybrid electronics including printable conductive composite inks, ceramics and ceramic matrix composites, polymer-derived ceramics, thin metal films, elastomers, solders and epoxies, to name a few. Collectively, these materials and associated components are used to construct Therefore, the blueprint for manufacturing resilient hybrid electronics consists of novel designs that exploit the benefits of advances in additive manufacturing that are then efficiently paired with commercially available components to produce devices that exceed know constraints. As a primary example, metals can be deposited onto polymers in a variety of ways including aerosol jetting, micro-dispensing, electroplating, sintering, vacuum deposition, supersonic beam cluster deposition and plasma-based techniques to name a few. Taking these scientific discoveries and creatively combining them into robotic, multi-material factories of the future could be one shared aim of the printed electronics community towards survivable device creation.

172 pages, Hardcover

Published February 28, 2024