Application of Fracture Mechanics in Electronic Packaging and Materials: Presented at the 1995 Asme International Mechanical Engineering Congress and ... Francisco, California (Eep

by Ga.) International Mechanical Engineering Congress and Exposition (1996 : Atlanta, Tien Y. Wu

Thirty-one technical papers representing a balance between university research and industrial practice, the results of which advance the quality and reliability of electronic products through fracture mechanics. Among the range of topics discussed at the symposium analytical and numerical anal

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First published January 1, 1995